隨著電子產品需求的功能越來越多，PCB線路板的結構也越來越復雜。由于pcb板的空間限制，線路板也正在由單層向雙層再向多層逐步“進化”。

　6層PCB板制作工藝

　　多層(ceng)(ceng)(ceng)(ceng)(ceng)pcb線路(lu)板(ban)(ban)是由交替(ti)的導電(dian)(dian)(dian)圖(tu)形層(ceng)(ceng)(ceng)(ceng)(ceng)及絕(jue)緣材料層(ceng)(ceng)(ceng)(ceng)(ceng)壓(ya)粘合而成的一(yi)種印制電(dian)(dian)(dian)路(lu)板(ban)(ban)。導電(dian)(dian)(dian)圖(tu)形的層(ceng)(ceng)(ceng)(ceng)(ceng)數在三層(ceng)(ceng)(ceng)(ceng)(ceng)以上，層(ceng)(ceng)(ceng)(ceng)(ceng)間電(dian)(dian)(dian)氣(qi)互(hu)連(lian)是通過金屬化孔實現的。如(ru)果用一(yi)塊(kuai)雙面(mian)板(ban)(ban)作為內(nei)層(ceng)(ceng)(ceng)(ceng)(ceng)、兩(liang)塊(kuai)單(dan)面(mian)板(ban)(ban)作為外層(ceng)(ceng)(ceng)(ceng)(ceng)或兩(liang)塊(kuai)雙面(mian)板(ban)(ban)做內(nei)層(ceng)(ceng)(ceng)(ceng)(ceng)、兩(liang)塊(kuai)單(dan)面(mian)板(ban)(ban)作為外層(ceng)(ceng)(ceng)(ceng)(ceng)，通過定位系統及絕(jue)緣黏結材料疊壓(ya)在一(yi)起，并將導電(dian)(dian)(dian)圖(tu)形按設計要求(qiu)進行(xing)互(hu)連(lian)，就成為四層(ceng)(ceng)(ceng)(ceng)(ceng)、六層(ceng)(ceng)(ceng)(ceng)(ceng)印制電(dian)(dian)(dian)路(lu)板(ban)(ban)，也稱(cheng)為多層(ceng)(ceng)(ceng)(ceng)(ceng)pcb線路(lu)板(ban)(ban)。

　　多層(ceng)pcb線路(lu)板(ban)(ban)一(yi)(yi)般用(yong)環氧玻璃布覆銅(tong)(tong)箔層(ceng)壓板(ban)(ban)制造，其制造工藝(yi)是(shi)在(zai)鍍覆孔(kong)(kong)雙(shuang)面(mian)板(ban)(ban)的(de)(de)(de)工藝(yi)基礎上發展(zhan)起來的(de)(de)(de)。它的(de)(de)(de)一(yi)(yi)般工藝(yi)流(liu)程(cheng)都是(shi)先(xian)將內層(ceng)板(ban)(ban)的(de)(de)(de)圖形蝕(shi)(shi)刻好，經過黑(hei)化處理后，按(an)(an)預定(ding)的(de)(de)(de)設計加(jia)(jia)入半固化片(pian)進(jin)(jin)行(xing)疊(die)層(ceng)，再在(zai)上下表(biao)面(mian)各放一(yi)(yi)張銅(tong)(tong)箔，送進(jin)(jin)壓機加(jia)(jia)熱加(jia)(jia)壓后，得到已制備(bei)好內層(ceng)圖形的(de)(de)(de)一(yi)(yi)塊“雙(shuang)面(mian)覆銅(tong)(tong)板(ban)(ban)”，然后按(an)(an)預先(xian)設計的(de)(de)(de)定(ding)位系(xi)統(tong)，進(jin)(jin)行(xing)數控鉆孔(kong)(kong)。鉆孔(kong)(kong)后要對孔(kong)(kong)壁進(jin)(jin)行(xing)凹蝕(shi)(shi)處理和去鉆污處理，然后就可按(an)(an)雙(shuang)面(mian)鍍覆孔(kong)(kong)印制電(dian)路(lu)板(ban)(ban)的(de)(de)(de)工藝(yi)進(jin)(jin)行(xing)下去。

　　以上(shang)就是小編(bian)整理的(de)關于“PCB板6層(ceng)板制作(zuo)工藝介紹”，希望對大家(jia)有所幫助，如還有不清楚的(de)地方(fang)，請聯系我司客服為您解(jie)答。